Published October 2008
| public
Journal Article
Novel thermoplastic bonding using a bulk metallic glass solder
Abstract
A novel thermoplastic bonding concept is demonstrated based on the unique rheological behavior and pattern-replicating ability of bulk metallic glass (BMG)-forming liquids. In this approach, the BMG is heated above Tg to the "supercooled liquid" region while a small normal force is applied to the joint. This results in liquid reflow, wetting and a strong bond. Complete wetting between copper substrates and a layer of platinum-based BMG leads to an atomistically intimate void-free interface.
Additional Information
Copyright © 2008 Acta Materialia Inc. Received 10 June 2008; revised 24 June 2008; accepted 25 June 2008. Available online 10 July 2008. The authors acknowledge the support from the INTEL Corporation under award No. 27940. This work benefited from use of the Caltech KNI and Mat Sci TEM facilities supported by the MRSEC Program of the National Science Foundation under Award Number DMR-0520565.Additional details
- Eprint ID
- 12163
- Resolver ID
- CaltechAUTHORS:SUHsm08
- Intel Corp.
- 27940
- Kavli Nanoscience Institute, Caltech
- National Science Foundation
- DMR-0520565
- Created
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2008-10-27Created from EPrint's datestamp field
- Updated
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2021-11-08Created from EPrint's last_modified field
- Caltech groups
- Kavli Nanoscience Institute