CaltechAUTHORS
Published October 2008 | Version public
Journal Article Metadata-only

Novel thermoplastic bonding using a bulk metallic glass solder

Creators

Abstract

A novel thermoplastic bonding concept is demonstrated based on the unique rheological behavior and pattern-replicating ability of bulk metallic glass (BMG)-forming liquids. In this approach, the BMG is heated above Tg to the "supercooled liquid" region while a small normal force is applied to the joint. This results in liquid reflow, wetting and a strong bond. Complete wetting between copper substrates and a layer of platinum-based BMG leads to an atomistically intimate void-free interface.

Additional Information

Copyright © 2008 Acta Materialia Inc. Received 10 June 2008; revised 24 June 2008; accepted 25 June 2008. Available online 10 July 2008. The authors acknowledge the support from the INTEL Corporation under award No. 27940. This work benefited from use of the Caltech KNI and Mat Sci TEM facilities supported by the MRSEC Program of the National Science Foundation under Award Number DMR-0520565.

Additional details

Identifiers

Eprint ID
12163
Resolver ID
CaltechAUTHORS:SUHsm08

Funding

Intel Corp.
27940
Kavli Nanoscience Institute, Caltech
National Science Foundation
DMR-0520565

Dates

Created
2008-10-27
Created from EPrint's datestamp field
Updated
2021-11-08
Created from EPrint's last_modified field

Caltech Custom Metadata

Caltech groups
Kavli Nanoscience Institute