Published March 10, 2006 | Version Published
Journal Article Open

Multiparadigm modeling of dynamical crack propagation in silicon using a reactive force field

  • 1. ROR icon Massachusetts Institute of Technology
  • 2. ROR icon California Institute of Technology

Abstract

We report a study of dynamic cracking in a silicon single crystal in which the ReaxFF reactive force field is used for several thousand atoms near the crack tip, while more than 100 000 atoms are described with a nonreactive force field. ReaxFF is completely derived from quantum mechanical calculations of simple silicon systems without any empirical parameters. Our results reproduce experimental observations of fracture in silicon including changes in crack dynamics for different crack orientations.

Additional Information

© 2006 The American Physical Society. Received 17 August 2005; published 10 March 2006. The CMDF development was supported by DARPA and completed with funding from DARPA PROM (C. Schwartz and S. Wax) with support from the Caltech DOE-ASC program. The facilities were supported by DURIP-ONR/ARO. Development of ReaxFF was supported by NSF-ITR (DMR-0427177) and DARPA-ONR (J. Goldwasser). Approved for Public Release, Distr. Unltd. (DARPA Distr. Stat. "A").

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Identifiers

Eprint ID
3775
Resolver ID
CaltechAUTHORS:BUEprl06

Funding

Defense Advanced Research Projects Agency (DARPA)
Department of Energy (DOE)
Office of Naval Research (ONR)
Army Research Office (ARO)
NSF
DMR-0427177

Dates

Created
2006-07-10
Created from EPrint's datestamp field
Updated
2021-11-08
Created from EPrint's last_modified field

Caltech Custom Metadata

Other Numbering System Name
WAG
Other Numbering System Identifier
0654