Welcome to the new version of CaltechAUTHORS. Login is currently restricted to library staff. If you notice any issues, please email coda@library.caltech.edu
Published July 1997 | public
Journal Article Open

Measurement of band offsets in Si/Si1–xGex and Si/Si1–x–yGexCy heterojunctions

Abstract

Realization of group IV heterostructure devices requires the accurate measurement of the energy band offsets in Si/Si1–xGex and Si/Si1–x–yGexCy heterojunctions. Using admittance spectroscopy, we have measured valence-band offsets in Si/Si1–xGex heterostructures and conduction-band and valence-band offsets in Si/Si1–x–yGexCy heterostructures grown by solid-source molecular-beam epitaxy. Measured Si/Si1–xGex valence-band offsets were in excellent agreement with previously reported values. For Si/Si1–x–yGexCy our measurements yielded a conduction-band offset of 100 ± 11 meV for a n-type Si/Si0.82Ge0.169C0.011 heterojunction and valence-band offsets of 118 ± 12 meV for a p-type Si/Si0.79Ge0.206C0.004 heterojunction and 223 ± 20 meV for a p-type Si/Si0.595Ge0.394C0.011 heterojunction. Comparison of our measured band offsets with previously reported measurements of energy band gaps in Si1–x–yGexCy and Si1–yCy alloy layers indicates that the band alignment is type I for the compositions we have studied and that our measured band offsets are in quantitative agreement with these previously reported results.

Additional Information

©1997 American Vacuum Society. (Received 12 January 1997; accepted 3 April 1997) The authors would like to acknowledge support from DARPA MDA972-95-3-0047 for work at UCSD, HRL, and ASU, and from ONR Grant No. N00014-95-I-0996 for work at UCSD. E.T.Y. would like to acknowledge receipt of a Sloan Research Fellowship. Two of the authors, B.L.S. and E.T.Y., would also like to thank S.S. Lau for part of the equipment used in this work.

Files

STEjvstb97.pdf
Files (108.9 kB)
Name Size Download all
md5:41477f24cf0304840c3fad37c9ad2bb0
108.9 kB Preview Download

Additional details

Created:
August 22, 2023
Modified:
October 16, 2023