Sintered copper sponges for use at low temperature

Abstract

IN several recently reported studies on the properties of adsorbed films of helium1- 4 we have used a sintered copper sponge as the adsorption substrate. The sponge provides a surface of large area in compact geometry. It also has rapid thermal equilibrium throughout its mass, approaching the high thermal conductivity of bulk polycrystalline copper metal. If the sponge is sintered inside a copper container, it sinters to the walls so assuring thermal contact with the container at low temperature. Use of the sponge and the technique of making it has evinced considerable interest in private communications, since the combination of high thermal conductivity and high surface area makes it potentially suitable both for adsorption studies, and as a material for increasing the thermal contact between a vessel and its contents at very low temperatures. This note describes the fabrication and some of the properties of these sponges.

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