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Published April 2011 | public
Journal Article

Parylene-based integrated wireless single-channel neurostimulator

Abstract

This paper presents the design, fabrication, and functional testing of a fully implantable, flexible, Parylene-enable neurostimulator that features single-channel wireless stimulation capability [1]. This system comprises a fold-and-bond microelectromechanical systems (MEMS) coil for wireless power and data transmission, a BION 1-3 CMOS stimulator chip, discrete capacitors, as well as a carrier substrate with two platinum stimulating electrodes and interconnections for system assembly. The physical geometries of the devices are designed for use in retinal implantation with the specifications determined from the implantation results in canine eyes. The coil and carrier substrate are separately fabricated using a Parylene–metal skin technology. The unique properties of Parylene C allow these MEMS devices to be flexible and biocompatible, facilitating surgical procedure. The system assembly is achieved by interconnecting individual components together on the carrier substrate with a biocompatible silver epoxy. A 10 μm layer of Parylene C is selectively deposited on the integrated system to protect it from corrosive eye environment. The system functionality is verified using a telemetry link setup, and single-phase pulses with amplitudes ranging from 7 to 8.5 V are detected.

Additional Information

© 2010 Elsevier B.V. Received 15 April 2009; Received in revised form 28 November 2009; Accepted 4 March 2010; Available online 16 March 2010. This work is supported in part by the Engineering Research Center Program of the National Science Foundation under Award Number EEC-0310723 and by a fellowship from the Whitaker Foundation (D.R.). The authors would like to thank Dr. Gerald Loeb and his group members for providing BION chips and testing units. My gratitude also goes to Mr. Trevor Roper and all other members of the Caltech Micromachining Laboratory for assistance with equipment and fabrication.

Additional details

Created:
August 22, 2023
Modified:
October 23, 2023