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Published June 2013 | public
Book Section - Chapter

Reliable packaging for parylene-based flexible retinal implant


MEMS technology has been used more and more in biomedical application for neural prosthetic implantation [1, 2]. These devices, however, will have to endure harsh and corrosive body fluids [3]. Therefore, biostable and hermetic-like packaging is needed to protect the implant. This work reports the package reliability of parylene-based retinal implant using active (i.e., with electrical signals applied) and accelerated lifetime soaking test in saline. Commercial amplifier chips, dummy conduction chips, and discrete components are tested and the failure modes are examined. It is found that the proposed parylene-metal-parylene flexible composite sandwich layers indeed have longer lifetime than traditional inflexible silicone-parylene combination. In addition, the chip size effect on lifetime is observed that smaller chips have longer lifetime under the same protection.

Additional Information

© 2013 IEEE. This work is supported by NSF BMES ERC center. The author would like to thank Mr. Trevor Roper for his help on all the equipments and all Caltech MEMS group members for their fruitful discussions and suggestions.

Additional details

August 19, 2023
October 26, 2023