Welcome to the new version of CaltechAUTHORS. Login is currently restricted to library staff. If you notice any issues, please email coda@library.caltech.edu
Published April 16, 2003 | Submitted
Report Open

Simulations of Computing by Self-Assembly

Abstract

Winfree (1996) proposed a Turing-universal model of DNA self-assembly. In this abstract model, DNA double-crossover molecules self-assemble to form an algorithmically-patterned two-dimensional lattice. Here, we develop a more realistic model based on the thermodynamics and kinetics of oligonucleotide hydridization. Using a computer simulation, we investigate what physical factors influence the error rates, i.e., when the more realistic model deviates from the ideal of the abstract model. We find, in agreement with rules of thumb for crystal growth, that the lowest error rates occur at the melting temperature when crystal growth is slowest, and that error rates can be made arbitrarily low by decreasing concentration and increasing binding strengths.

Additional Information

© 1998 California Institute of Technology. May 31, 1998. I am deeply grateful for stimulating discussions, suggestions, questions, and technical help from John Hopfield, Sanjoy Mahajan, Paul Rothemund, Len Adleman, John Reif, and James Wetmur. All errors, whatever their rate may be, are mine. MATLAB 5.2 code for running the simulations and reproducing all the figures in this paper may be obtained from the author. This work has been supported by the National Institute for Mental Health (Training Grant # 5 T32 MH 19138-07. General Motors' Technology Research Partnerships program, and by the Center for Neuromorphic Systems Engineering as a part of the National Science Foundation Engineering Research Center Program under grant EEC-9402726).

Attached Files

Submitted - 22.pdf

Submitted - 22.ps

Files

22.pdf
Files (7.9 MB)
Name Size Download all
md5:af7de2bfaf21c72aa0780661c8b9296c
4.8 MB Preview Download
md5:66a08c9bb152e859d6544ed8098a5177
3.1 MB Download

Additional details

Created:
August 19, 2023
Modified:
October 24, 2023