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Published January 2004 | Published
Book Section - Chapter Open

Underwater flexible shear-stress sensor skins


This paper reports the development of underwater flexible shear-stress sensor skins that enable not only the acquisition of shear-stress distributions on non-planar surfaces but also a reliable packaging scheme. The sensor skin fabrication consists of two steps: the fabrication of shear-stress sensors on silicon wafers and the fabrication of flexible skins by forming arrays of silicon islands sandwiched by two polyimide layers. The fabricated sensor skin has been packaged on a metal plug and bonding pads were folded to the back side through a slit on the plug. Wire bonding was performed on the back side to improve the reliability and minimize flow interference. The packaged sensor skin has been installed on a water tunnel and successfully tested.

Additional Information

© 2004 IEEE. This project is supported by the Office of Naval Research through an SBIR grant and the NSF Center for Neuromorphic System Engineering at Caltech.

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August 19, 2023
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